Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, and semiconductor chip packaging body

ABSTRACT

A semiconductor chip carrying adhesive tape, wherein a plurality of adhesive agent portions for adhering semiconductor chips  2  are intermittently formed on a tape shaped base material  11  in the longitudinal direction of the base material  11  to have a substantially identical shape with that of the semiconductor chip  2  to be adhered or a slightly larger shape than that, and an adhesive agent constituting said adhesive agent portions  12  has gradable adhesiveness, can improve a yield of adhesive agent attached semiconductor chips  2  and prevent a wasteful use of an adhesive agent.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor chip carrying adhesivetape/sheet, a semiconductor chip carrier and a semiconductor chippackaging body, to be used when mounting a semiconductor chip on a leadframe, or storing, transporting or automatically taking out thesemiconductor chip before the mounting, and a method of producing thesemiconductor chip carrier, a method of mounting the semiconductor chipand a method of packaging the semiconductor chip.

2. Description of the Related Art

When mounting a semiconductor chip on a lead frame, processes below areperformed in the related art.

(1) Grinding a back surface of a semiconductor wafer to make thesemiconductor wafer have a desired thickness.

(2) Sticking an adhesive sheet to the semiconductor wafer.

(3) Sticking a wafer dicing sheet in accordance with need to fix thesemiconductor wafer to a ring frame.

(4) Dicing the semiconductor wafer by a dicer.

(5) Expanding the wafer dicing sheet in accordance with need to separatethe semiconductor chips obtained by the dicing.

(6) Picking up the semiconductor chip attached with an adhesive agent.

(7) Mounting the adhesive agent attached semiconductor chip on a leadframe and adhering the semiconductor chip to the lead frame via anadhesive agent.

In the method of mounting a semiconductor chip by the above processes,however, defective semiconductor chips wherein cutouts and cracks, etc.occurred at the time of dicing are also stuck to the adhesive sheet.Therefore, the yield is low and the adhesive sheets are wastefully used.Particularly, when an adhesive agent of the adhesive sheet is conductiveand, for example, a large amount of a precious metal such as Ag powders,is contained in the adhesive agent, it ends up in wasting very highcosts.

SUMMARY OF THE INVENTION

The present invention was made in consideration with the abovecircumstances and has as an object thereof to provide a semiconductorchip carrying adhesive tape and sheet capable of improving an yield ofadhesive agent attached chips and preventing wasteful use of an adhesiveagent, a semiconductor chip carrier, a method of producing the same, amethod of mounting the semiconductor chip, a semiconductor chippackaging body, and a method of packaging the semiconductor chip byusing the semiconductor chip carrying adhesive tape or sheet.

To attain the above object, according to the present invention, there isprovided a semiconductor chip carrying adhesive tape, wherein aplurality of adhesive agent portions for adhering a semiconductor chipare intermittently formed on a tape shaped base material in alongitudinal direction of the base material, in a substantiallyidentical shape with that of the semiconductor chip to be adhered or aslightly larger shape than that of the semiconductor chip to be adhered,and an adhesive agent constituting the adhesive agent portions hasgradable adhesiveness (claim 1).

The semiconductor carrying adhesive tape may be wound to be a woundbody. In this case, a release film may be stuck on the surface of thesemiconductor chip carrying adhesive tape.

The adhesive agent which has gradable adhesiveness may have a stage ofexhibiting tackiness (removable adhesiveness) and a stage ofexhibiting-adhesiveness (a so-called tacky adhesive agent), or may bethose which do not exhibit any tackiness/adhesiveness in a normal statebut exhibit gradable tackiness/adhesiveness by a heat, compression orother triggers. Thus the adhesive agent of the adhesive agent portionhas such gradable adhesiveness, sticking to a semiconductor chip andtemporary/actual adhesion to a lead frame can be efficiently performed.

In the above invention (claim 1), second adhesive agent portions foradhering a cover member (here, “adhering” includes concepts of stickingand affixing) may be adhered at both end portions of the tape shapedbase material so as not to contact the adhesive agent portion foradhering the semiconductor chip (claim 2).

According to the present invention, there is provided a semiconductorchip carrying adhesive sheet, wherein a plurality of adhesive agentportions for adhering semiconductor chips are formed on a sheet shapedbase material, in a substantially identical shape with that of thesemiconductor chips to be adhered or a slightly larger shape than thesemiconductor chips to be adhered, and an adhesive agent constitutingthe adhesive agent portions has gradable adhesiveness (claim 3).

According to the present invention, there is provided a semiconductorchip carrier, which can be obtained by sticking a semiconductor chip tothe adhesive agent portion of the semiconductor chip carrying adhesivetape according to the above invention (claims 1 and 2) or to theadhesive agent portion of the semiconductor chip carrying adhesive sheetaccording to the above invention (claim 3) (claims 4 and 5).

According to the present invention, there is provided a firstsemiconductor chip packaging body, which can be obtainable by adheringthe semiconductor chip carrier according to the above invention (claim4) and a continuous cover member on which a plurality of chip housingsare intermittently formed in the longitudinal direction so that thesemiconductor chips on the semiconductor chip carrier are housed in thechip housings on the cover member (claim 8), and a second semiconductorchip packaging body, which can be obtainable by adhering thesemiconductor chip carrier according to the above invention (claim 5)and a tray shaped cover member on which a plurality of chip housings areformed so that the semiconductor chips on the semiconductor chip carrierare housed in the chip housings on the cover member (claim 9). Note that“adhering” here includes concepts of sticking, affixing and fusionbonding.

When using the semiconductor chip carrying adhesive tape or thesemiconductor chip carrying adhesive sheet according to the presentinvention, since only non-defective semiconductor chips can be stuck tothe adhesive agent portion for adhering the semiconductor chip of thesemiconductor chip carrying adhesive tape or the semiconductor chipcarrying adhesive sheet, a yield of adhesive agent attachedsemiconductor chips which should be mounted on a lead frame can beimproved and a wasteful use of an adhesive agent can be prevented.Particularly, when the adhesive agent portion contains a conductivematerial made of a precious metal, such as Ag powders, costs for theadhesive agent can be considerably reduced comparing the case ofsticking the adhesive agent portion allover the semiconductor wafer.

Also, in the present invention, since the adhesive agent portion formedon the base material is formed in a substantially identical shape withthat of a semiconductor chip to be adhered or a slightly larger shapethan that of the semiconductor chip to be adhered, there is an advantagethat cutting of the adhesive agent portion is not necessary.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects and features of the present invention willbecome clearer from the following description of the preferredembodiments given with reference to the attached drawings, in which:

FIG. 1 is a perspective view of a semiconductor chip carrying adhesivetape according to an embodiment of the present invention;

FIG. 2 is an overall perspective view of the semiconductor chip carryingadhesive tape according to the same embodiment;

FIG. 3 is a schematic side view when sticking the semiconductor chipcarrying adhesive tape according to the same embodiment and asemiconductor chip;

FIG. 4 is a perspective view of a semiconductor chip carrier accordingto the same embodiment;

FIG. 5 is a perspective view of a cover member according to the sameembodiment;

FIG. 6 is a schematic side view when adhering the semiconductor chipcarrier and the cover member according to the same embodiment;

FIG. 7 is a schematic sectional view of a state where the semiconductorchip carrier and the cover member according to the same embodiment areadhered;

FIG. 8 is a perspective view of a semiconductor chip carrying adhesivesheet according to another embodiment of the present invention;

FIG. 9 is a perspective view of a cover member according to the sameembodiment; and

FIG. 10 is a schematic perspective view of when adhering thesemiconductor chip and the cover member carrier according to the sameembodiment.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Below, embodiments of the present invention will be explained.

First Embodiment

FIG. 1 is a perspective view of a semiconductor chip carrying adhesivetape according to a first embodiment of the present invention, FIG. 2 isan overall perspective view of the semiconductor chip carrying adhesivetape according to the same embodiment, FIG. 3 is a schematic side viewwhen sticking the semiconductor chip carrying adhesive tape according tothe same embodiment and a semiconductor chip, FIG. 4 is a perspectiveview of a semiconductor chip carrier according to the same embodiment,FIG. 5 is a perspective view of a cover member according to the sameembodiment, FIG. 6 is a schematic side view when adhering thesemiconductor chip and the cover member carrier according to the sameembodiment, and FIG. 7 is a schematic sectional view of a state wherethe semiconductor chip carrier and the cover member according to thesame embodiment are adhered.

Semiconductor Chip Carrying Adhesive Tape 1

As shown in FIG. 1, a semiconductor chip carrying adhesive tape 1according to a first embodiment of the present invention comprises abase material 11, a plurality of adhesive agent portions 12 for adheringto a semiconductor chip intermittently formed in the longitudinaldirection of the base material 11, and adhesive agent portions 13 foradhering a cover member formed at both end portions of the base material11.

Adhesive Agent Portion 12

The adhesive agent portion 12 is made to have a substantially identicalshape with that of a semiconductor chip to be adhered or a slightlylarger shape than that of the semiconductor chip to be adhered,preferably, to have an identical shape with that of the semiconductorchip. When the adhesive agent portion 12 is smaller than thesemiconductor chip to be adhered, a space is formed in the semiconductordevice when being encapsulated and reliability of the semiconductordevice to be obtained declines. On the other hand, when the adhesiveagent portion 12 is too large, the semiconductor device cannot be madecompact.

A thickness of the adhesive agent portion 12 is normally 3 to 200 μm,preferably 5 to 100 μm.

The adhesive agent portion 12 is comprised of an adhesive agent havinggradable adhesiveness. The adhesive agents which exhibit gradableadhesiveness include those having a stage of tackiness (removableadhesiveness) and a stage of adhesiveness (a so-called tacky adhesiveagent) and also include those which do not exhibit anytackiness/adhesiveness in a normal state but exhibit gradabletackiness/adhesiveness by a heat, compression or other triggers.

An adhesive agent (tacky adhesive agent) of the former type may be, forexample, a composition (a) containing a thermosetting resin and a tackycomponent, while an adhesive agent of the latter type may be, forexample, a polyimide type resin (b) and an epoxy type resin (c), etc.The resins or the resin compositions may be used alone, or a materialwherein the resin or the resin composition is used as a matrix can bealso used.

a. Composition Containing Thermosetting Resin and Tacky Component

In a composition containing a thermosetting resin and an tackycomponent, mainly the thermosetting resin exhibits adhesiveness and thetacky component exhibits tackiness. Examples of the thermosetting resinin such a composition include an epoxy resin, a phenol resin, an urearesin, a melanin resin, an unsaturated polyester resin, a resorcinolresin, a furan resin, a polyurethane resin, a silicone resin etc. Anepoxy resin is preferable among them. On the other hand, examples of thetacky component include an acrylic type adhesive, a rubber typeadhesive, a polyester type adhesive, or thermoplastic resins such aspolyolefin, polyvinyl chloride, polystyrene, thermoplastic polyamide andpolyester. A photopolymerizable composition may be included therein. Assuch a tacky component, a (meth)acrylate copolymer is preferable.

Particularly preferable composition containing a thermoplastic resin anda tacky component is a composition (hereinafter, also referred to as“composition A”) containing a (meth)acrylate copolymer having aweight-average molecular weight of not less than 30000, an epoxy resinhaving a weight-average molecular weight of 100 to 10000, aphotopolymerizable low molecular compound and thermal activation latentepoxy resin curing agent.

The (meth)acrylate copolymer having a weight-average molecular weight ofnot less than 30000 may be a copolymer obtained by copolymerizingmonomers, such as, (meth)acrylic acid, for example, alkyl (meth)acrylatederived from (meth)acrylic acid and alcohol having a carbon number of 1to 14, hydroxyethyl (meth)acrylate, glycidyl (meth)acrylate, etc. Acopolymer of (meth)acrylic acid and/or glycidyl (meth)acrylic acid andat least one kind of alkyl (meth)acrylate is preferable among them.

Examples of alkyl (meth)acrylate derived from (meth)acrylic acid andalcohol having a carbon number of 1 to 14 include methyl (meth)acrylate, ethyl (meth) acrylate, butyl (meth)acrylate, etc.

When using a copolymer derived from (meth) acrylic acid and/or glycidyl(meth)acrylic acid as a (meth)acrylate copolymer, a content of acomponent unit derived from glycidyl (meth) acrylic acid in thecopolymer is normally made to be 0 to 80 mol %, preferably 5 to 50 mol%, and a content of a component unit derived from (meth)acrylic acid isnormally made to be 0 to 40 mol %, preferably 5 to 20 mol %. In thiscase, as monomer components other than (meth) acrylic acid and glycidyl(meth)acrylic acid constituting (meth)acrylate copolymer, it ispreferable to use alkyl (meth)acrylate, such as, methyl (meth)acrylate,ethyl (meth)acrylate, butyl (meth)acrylate, etc.

An epoxy resin having a weight-average molecular weight of 100 to 10000may be glycidyl ether of a phenol series, such as, bisphenol A,bisphenol F, resorcinol, phenyl novolac, cresol novolac; glycidyl etherof an alcohol series, such as, butanediol, polyethylene glycol,polypropylene glycol; glycidyl ether of carboxylic acid, such as,phthalic acid, isophthalic acid, tetrahydro phthalic acid; a glycidyltype or alkyl glycidyl type epoxy resin obtained by substituting activehydrogen bonded with nitrogen atom, such as aniline isocyanurate, with aglycidyl group; and so-called alicycle epoxide wherein an epoxy group isintroduced by, for example, oxidizing carbon-carbon double bond inmolecular, such as, vinyl cyclohexene epoxide, 3,4-epoxy cyclohexylmethyl-3,4-dicyclohexane carboxylate, 2-(3,4-epoxy) cyclohexyl-5,5-spiro(3,4-epoxy) cyclohexane-m-dioxane, etc.

An epoxy equivalent weight of the above epoxy resins is preferably 50 to5000 g/eq. The above epoxy resins may be used alone or by combiningdifferent kinds. Among these epoxy resins, bisphenol series glycidyltype epoxy resin, o-cresol novolac type epoxy resin and phenol novolactype epoxy resin are preferably used.

The above epoxy resins are used in an amount of a range of normally 5 to2000 parts by weight, preferably 100 to 1000 parts by weight withrespect to 100 parts by weight of (meth)acrylate copolymer.

A photopolymerizable low molecular compound is a compoundable to becrosslinked by being irradiated an energy rays, such as, ultravioletrays, electron rays, etc. As such a compound, oligomer wherein there isat least one photopolymerizable double bond in molecular and aweight-average molecular weight (Mw) is in a range of 100 to 30000,preferably 300 to 10000 may be used.

Example of a photopolymerizable low molecular compound may be urethanemodified acrylate, epoxy modified acrylate, polyester acrylate,polyether acrylate; (meth) acrylic acid oligomer, itaconic acid oligomerand other oligomers having a functional group, such as hydroxy group orcarboxyl group. Epoxy modified acrylate and urethane modified acrylateare preferably used among these.

Note that different points between the above photopolymerizable lowmolecular compound and the above (meth) acrylate copolymer or an epoxyresin are that an upper limit of a weight-average molecular weight ofthe photopolymerizable low molecular compound is 30000 while that of theabove (meth)acrylate copolymer is not less than 30000, and that thephotopolymerizable low molecular compound always has at least onephotopolymerizable double bond in its molecular while the above(meth)acrylate copolymer and epoxy resin normally do not havephotopolymerizable double bond.

The above photopolymerizable low molecular compound is used in an amountof a range of normally 10 to 1000 parts by weight, preferably 50 to 600parts by weight with respect to 100 parts by weight of (meth)acrylatecopolymer.

When using ultraviolet rays for crosslinking the abovephotopolymerizable low molecular compound, it is preferable that aphotopolymerizing initiator is blended in the composition A. Aphotopolymerizing initiator may be benzophenone, acetophenone, benzoin,benzoin alkyl ether, benzil, benzil dimethyl ketal, etc. Thesephotopolymerizing initiators may be used alone or by combining differentkinds. It is preferable to use α-substituted acetophenone among these.

The above photopolymerizing initiator is used in an amount of a range ofnormally 0.1 to 10 parts by weight, preferably 1 to 5 parts by weightwith respect to 100 parts by weight of a photopolymerizable lowmolecular compound.

A thermal activation latent epoxy resin curing agent is a curing agentof a type that does not react with epoxy resins at a room temperaturebut activates by a heat of a certain temperature or more and reacts withepoxy resins. As kinds (divided by activation processes) of thermalactivation latent epoxy resin curing agents, there are those whichgenerate active species (anion, cation) by a chemical reaction due toheating, those which are stably dispersed in an epoxy resin around aroom temperature but become compatible and dissolved in an epoxy resinat a high temperature to start a curing reaction, those which are a typeof curing agent contained in molecular sieves which is released at ahigh temperature to start a curing reaction, and those encapsulated in amicro-capsule, etc. These thermal activation latent epoxy resin curingagents can be used alone or by combining different kinds, and amongthese, it is preferable to use dicyanamide, imidazole compound, or amixture of the dicyanamide and imidazole compound.

The above thermal activation latent epoxy resin curing agents are usedin an amount of a range of normally 0.1 to 40 parts by weight,preferably 1 to 30 parts by weight with respect to 100 parts by weightof an epoxy resin.

Note that a thermo-curing agent, such as polyisocyanate compound, otherthan the above thermal activation latent epoxy resin curing agents maybe blended so as to change an adhesion ability of the compound A. Thethermo-curing agent is used in an amount of a range of normally 0.1 to30 parts by weight, preferably 5 to 20 parts by weight with respect to100 parts by weight of (meth)acrylate copolymer.

b. Polyimide Type Resin

Examples of a polyimide type resin include a polyimide resin, apolyisoimide resin, maleimide resin, a bismaleimide resin, apolyamide-imide resin, a polyetherimide resin, apoly-imide-isoindoloquinazolinedioneimide resin, etc. These polyimidetype resins may be used alone or by combining different kinds. It ispreferable to use a polyimide resin among these. Furthermore, inpolyimide resins, there are thermoplastic polyimide resins which do nothave a reactive functional group and thermoplastic polyimide resinswhich show an imidation reaction by heating. Any of these may be used orthe both may be mixed to be used.

A weight-average molecular weight of polyimide type resins is preferablyabout 10,000 to 1,000,000, particularly about 50,000 to 100,000.

c. Epoxy Type Resin

As an epoxy type resin, those similar to the epoxy resins of the abovecomposition A may be used. The weight-average molecular weight ispreferably about 100 to 100,000.

The above resins or resin compositions may be blended additives, suchas, a leuco dye, an antistatic agent, a coupling agent, an ion scavengerand a copper inhibitor, and other polymers, oligomers and low molecularcompounds, etc.

As a leuco dye, 3-[N-(P-tolylamino)-7-anilinofluoran,4,4′,4″-trisdimethylamino triphenylmethane, etc. may be used, and as anantistatic agent, carbon black, anion type and cation typesurface-active agents, etc. may be used.

Also, other polymers, oligomers and low molecular compounds may be, forexample, a variety of polymers or oligomers, such as, an epoxy resin, anamide resin, an urethane resin, an amide acid resin, a silicone resin,an acrylic resin and acrylic rubber; and nitrogen-contained organiccompounds, such as, triethanolamine, α, ω-(bis3-aminopropyl)polyethylene glycol ether.

Also, the adhesive agent portion 12 may contain an inorganic filler,conductive material, etc. other than an adhesive agent as a matrix.

An inorganic filler may be a fused silica, crystal silica, alumina,boron nitride, aluminum nitride, silicon nitride, magnesia, magnesiumsilicate, etc. Note that when filling up the above composition A with alight scattering inorganic filler, such as silica powder and aluminapowder, a photopolymerizable low molecular compound in the composition Acan be efficiently polymerized by irradiating a light.

Examples of the conductive material include particles made of a metalhaving an excellent conductivity, such as Ni, Ag, Au, Cu and solder,polymer particles covered with these metals, or carbon, etc. When givingconductivity to the adhesive agent portion 12, normally 50 to 95 partsby weight of conductive materials are blended with respect to 100 partsby weight of an adhesive agent.

The adhesive agent portion 12 explained above can be formed by a methodof coating an adhesive agent to a base material 11 to have apredetermined shape (a substantially identical shape with that of asemiconductor chip to be adhered or a shape slightly larger than that ofthe semiconductor chip) by screen process printing, or by a method ofcoating the adhesive agent by roller printing, gravure printing, ormicro-die method, etc., and then processing the adhesive agent layer tohave the above predetermined shape.

Note that when preparing and coating the above adhesive agent, a solventwherein respective components of the adhesive agent can be uniformlydissolved and dispersed can be also used. The solvent is notparticularly limited as far as it is capable of uniformly dissolving anddispersing the respective components therein. Examples of the solventinclude dimethylformamide, dimethylacetamide, N-methyl-pyrrolidone,dimethyl sulfoxide, diethylene glycol dimethyl ether, toluene, benzene,xylene, methyl ethyl ketone, tetrahydrofuran, ethyl-Cellosolve, dioxane,cyclopentanone, cyclohexanone, monoglyme, etc. These solvents can beused alone or by being mixed with different kinds.

Base Material 11

Any material would be basically sufficient as a base material 11 in thepresent embodiment as far as it supports the adhesive agent portion 12and is able to be removed from the adhesive agent portion 12, and it mayalso have stiffness.

Examples of the base material 11 include films made by resins, such as,polyethylene, polypropylene, polybutene, polybutadiene, vinyl chloride,ionomer, ethylene-methacrylic acid copolymer, polyethyleneterephthalate, polyethylene naphthalate, polybutylene terephthalate,polyimide, polyetherimide, polyaramide, polyetherketone, polyether etherketone, polyphenylene sulfide, poly (4-methylpentene-1),polytetrafluoroethylene, and those obtained by crosslinking theseresins. These films may be used alone or by laminating different kinds.A film thickness thereof is normally about 5 to 300 μm, preferably 20 to100 μm.

Also, other than the above films, papers, such as, a glassine paper,clay coated paper, resin coated paper, a laminated paper (polyethylenelaminated paper, polypropylene laminated paper, etc.) or nonwovenfabrics, metallic foils, etc. may be used.

A surface tension of a surface of the base material ii on which theadhesive agent portion 12 is formed is preferably not more than 40dyne/cm. Release treating may be performed on the surface of the basematerial 11 on which the adhesive agent portion 12 is formed to adjustthe surface tension to be a preferable value. Alkyd resin type, siliconeresin type, fluorine resin type, unsaturated polyester resin type,polyolefin resin type and wax type releasing agents, etc. may be usedfor the release treating. Note that when the base material 11 itself hasthe above surface tension, the base material 11 can be used as it iswithout any release treating.

When using the above composition A for the adhesive agent portion 12, itis preferable to use as the base material 11 a material wherein anenergy rays to be irradiated on the composition A can permeate, and itis particularly preferable to use a material having a low adhesivenessto the composition A having improved tackiness due to the energy raysirradiation.

On the other hand, when a polyimide type resin or an epoxy type resin isused for the adhesive agent portion 12, it is preferable to use as thebase material 11 a film made of a heat resistance resin. A fusing pointof the heat resistance resin is preferably not less than 230° C., morepreferably 250 to 300° C., and particularly preferably 260 to 280° C.

Adhesive Agent Portion 13

A form of an adhesive agent portion 13 is not particularly limited asfar as it is formed not to contact the adhesive agent portion 12 foradhering the above semiconductor chip. The adhesive agent portion 13 inthe present embodiment is linearly formed at the both end portions ofthe base material 11, but the form of the adhesive agent portion 13 maybe an intermittent linear shape or dots. A thickness of the adhesiveagent portion 13 is normally 5 to 50 μm, preferably 10 to 30 μm.

As an adhesive agent constituting the adhesive agent portion 13, avariety of adhesive agents are used, such as, an acrylic type, rubbertype, silicone type adhesive agents, etc., a pressure-sensitive adhesiveagent or a hot melt type adhesive agent.

The adhesive agent portion 13 can be formed by coating an adhesive agenton the base material 11 by screen process printing, roller printing,gravure printing, micro-die, dispenser, etc. The adhesive agent may becoated by being dissolved or dispersed in a solvent in accordance withneed.

Note that a semiconductor chip carrying adhesive tape 1 in the presentembodiment has an adhesive agent portion 13 for adhering a cover member,but when a cover member is not used, for example, when mounting asemiconductor chip stuck on the semiconductor chip carrying adhesivetape 1 directly on a lead frame, the adhesive agent portion 13 is notnecessary. Also, even when a cover member is used, the adhesive agentportion 13 on the semiconductor chip carrying adhesive tape 1 sidebecomes unnecessary if an adhesive agent portion is formed on the covermember side. Furthermore, when the semiconductor chip carrying adhesivetape 1 and the cover member are fusion bonded by heating, the adhesiveagent portion 13 is unnecessary.

Wound body of Semiconductor Chip Carrying Adhesive Tape 1

As shown in FIG. 2, the above semiconductor chip carrying adhesive tape1 may be wound to be a wound body. When the semiconductor chip carryingadhesive tape 1 is wound to be a wound body, storage and transportationthereof become convenient and it can be also automatically taken out.

When the semiconductor chip carrying adhesive tape 1 is made to be awound body, a release film may be stuck on the surface of thesemiconductor chip carrying adhesive tape 1, so that the adhesive agentportion 12 for adhering the semiconductor chip or the adhesive agentportion 13 for adhering the cover member does not adhere to the backsurface of the base material 11. As the release film, for example, filmsbeing coated a release agent, such as a silicone type resin, a fluorinetype resin or a long chain alkyl type resin, and a fluorine type resinfilm may be used.

Semiconductor Chip Carrier 3

As shown in FIG. 4, a semiconductor chip carrier 3 according to thepresent embodiment is obtained by sticking a semiconductor chip 2 to theadhesive agent portion 12 of the above semiconductor chip carryingadhesive tape 1.

A method of sticking the semiconductor chip 2 to the adhesive agentportion 12 of the semiconductor chip carrying adhesive tape 1 is notparticularly limited. For example, a method below may be performed.

Namely, as shown in FIG. 3, the semiconductor chip carrying adhesivetape 1 with its adhesive agent portion 12 facing downward is moved inthe longitudinal direction of the tape so as to be a linear state froman arc state. Such an operation can be attained for example by windingthe semiconductor chip carrying adhesive tape 1 while taking it out fromthe wound body of the semiconductor chip carrying adhesive tape 1. Atthe same time, semiconductor chips 2 are placed at predeterminedintervals on a conveyor and the conveyor is moved in accordance with theabove semiconductor chip carrying adhesive tape 1.

At this time, a positional relationship of the conveyor and thesemiconductor chip carrying adhesive tape 1 is adjusted so that thesemiconductor chip 2 and the adhesive agent portion 12 of thesemiconductor chip carrying adhesive tape 1 in a linear state touch orcontact with pressure. Also, the intervals between the semiconductorchips 2 placed on the conveyor and a moving speed of the conveyor aresuitably adjusted so that each of the semiconductor chips 2 is stuck toeach of the adhesive agent portions 12.

According to the above method, the semiconductor chips 2 can besuccessively and efficiently stuck to the adhesive agent portions 12 ofthe semiconductor chip carrying adhesive tape 1.

Incidentally, when the adhesive agent portion 12 of the semiconductorchip carrying adhesive tape 1 has tackiness, the above sticking can beattained by an adhesion force of the tackiness. When the adhesive agentportion 12 of the semiconductor chip carrying adhesive tape 1 does nothave any tackiness, it is preferable to stick the adhesive agent portion12 and the semiconductor chip 2 by hot pressing. The heating temperatureof the hot pressing is preferably about 30 to 300° C., particularlypreferably about 50 to 200° C., the heating time is preferably about 1second to 10 minutes, particularly preferably about 1 to 30 seconds, andthe pressure is preferably about 1 to 10 kg/cm², particularly preferablyabout 1 to 5 kg/cm².

Since only non-defective semiconductor chips 2 can be stuck to theadhesive agent portions 12 in the above semiconductor chip carryingadhesive tape 1 or the semiconductor chip carrier 3, the yield of thesemiconductor chips 2 attached with the adhesive agent portion 12 to bemounted on a lead frame can be improved and a wasteful use of theadhesive agent can be prevented. Particularly, when the adhesive agentportion 12 contains a conductive material made of a precious metal, suchas Ag powder, costs for the adhesive agent can be considerably reducedcomparing with the case of sticking the adhesive agent portion 12 to anoverall surface of the semiconductor wafer.

Also, since the adhesive agent portion 12 formed on the base material 11is formed in substantially identical shape with that of a semiconductorchip 2 to be adhered or a slightly larger shape than that of thesemiconductor chip 2 to be adhered, there is an advantage that cuttingof the adhesive agent portion 12 is unnecessary.

Mounting of Semiconductor Chip 2

A semiconductor chip 2 can be directly put on a lead frame from theabove semiconductor chip carrier 3. Specifically, first, thesemiconductor chip 2 together with an adhesive agent portion 12 ispicked up (a semiconductor chip 2 attached with an adhesive agentportion 12 is picked up) from the base material 11 of the semiconductorchip carrier 3 and put on an island portion of the lead frame with theadhesive agent portion 12 facing downward.

Incidentally, when the above composition A is used for the adhesiveagent portion 12 of the semiconductor chip carrying adhesive tape 1, itis preferable that energy rays is irradiated to the adhesive agentportion 12 from the base material 11 side of the semiconductor chipcarrying adhesive tape 1 before picking up the semiconductor chip 2attached with the adhesive agent portion 12. As the energy rays,ultraviolet rays having a center wavelength of about 365 nm and electronrays, etc. may be used.

When using ultraviolet rays as the energy rays, normally, theilluminance is set in a range of 20 to 500 mW/cm² and the irradiationtime is set in a range of 0.1 to 150 seconds. Also, for example whenusing electron rays, conditions can be set conforming to the case ofultraviolet rays. Note that heating may be also auxiliary performed atthe time of irradiating the above energy rays.

By irradiating energy rays as such, an adhesion force between thesemiconductor chip 2 and the adhesive agent portion 12 is normallyimproved to 50 to 4000 g/25 mm, preferably 100 to 3000 g/25 mm. On theother hand, an adhesion force between the adhesive agent portion 12 andthe base material 11 normally declines to 1 to 500 g/25 mm, preferably100 g/25 mm or less. Therefore, the adhesive agent portion 12 can besurely removed from the base material 11 while adhering the adhesiveagent portion 12 to the semiconductor chip 2 side.

The semiconductor chip 2 is firmly adhered to the lead frame via theadhesive agent portion 12. The adhering process can be performedgenerally by heating. The heating is preferably performed at the time ofputting the semiconductor chip 2 on the lead frame or immediately afterthe putting. At this time, when the adhesive agent portion 12 does nothave any tackiness, a temporary adhesion is preferably performed beforean actual adhesion.

A heating temperature of the temporary adhesion is normally 100 to 300°C., preferably 150 to 250° C., a heating time is normally 1 second to 10minutes, preferably 1 to 30 seconds, while a heating temperature of theactual adhesion is normally 100 to 300° C., preferably 150 to 250° C.and a heating time is normally 1 to 120 minutes, preferably 1 to 60minutes. By heating in this way, an adhesive agent of the adhesive agentportion 12 is fused or hardened so that the semiconductor chip 2 (or asemiconductor chip) and the lead frame are firmly adhered.

During the above heating, the semiconductor chip 2 and the lead framemay be pressed to adhere by applying a suitable pressure in thethickness direction of a laminate formed by the semiconductor chip 2,the adhesive agent portion 12, and the lead frame.

Semiconductor Chip Packaging Body 5

When storing or transporting the above semiconductor chip carrier 3, acover member 4 as shown in FIG. 5 can be adhered to the semiconductorchip carrier 3 to obtain a semiconductor chip packaging body 5 as shownin FIG. 7.

The cover member 4 shown in FIG. 5 is continuous having a width andlength corresponding to the above semiconductor chip carrier 3, whereina plurality of rectangular concave portions intermittently formed in thelongitudinal direction of the cover member 4 constitute chip housings41. The chip housings 41 are formed to be larger than the semiconductorchip 2 attached with the adhesive agent portion 12 in the abovesemiconductor chip carrier 3 so as to be able to house the semiconductorchip 2 attached with the adhesive agent portion 12 therein.

As a material of the cover member 4, those having a certain degree ofstiffness are normally preferable. Such a material may be, for example,paper; plastics, such as, polyethylene, polypropylene, a vinyl chloridetype resin, a polystyrene resin, polycarbonate, polyethyleneterephthalate, polyacrylonitrile, etc. Note that the plastics may befilled with carbon, etc. for giving an antistatic property.

A method of adhering the cover member 4 to the semiconductor chipcarrier 3 is not particularly limited. For example, as shown in FIG. 6,a method of winding the semiconductor chip carrier 3 pulled out from acertain direction and the cover member 4 pulled out from a differentdirection while adhering them at a time can be applied. At this time, itis necessary to align the semiconductor chip carrier 3 with the covermember 4 so that the semiconductor chips 2 attached with adhesive agentportions 12 on the semiconductor chip carrier 3 can be housed in thechip housings 41 on the cover member 4. According to the method, a woundbody of the semiconductor chip packaging body 5 can be effectivelyobtained.

In the semiconductor chip packaging body 5 obtained as above, as shownin FIG. 7, the base material 11 of the semiconductor chip carrier 3 andthe cover member 4 are adhered via the adhesive agent portion 13, andthe adhesive agent portions 12 formed on the base material 11 of thesemiconductor chip carrier 3 and the semiconductor chips 2 are housed inthe chip housings 41 of the cover member 4. Such a semiconductor chippackaging body 5 is suitable for storing and transporting asemiconductor chip carrier 3 (a semiconductor chip 2 attached with anadhesive agent portion 12).

Second Embodiment

A semiconductor chip carrying adhesive sheet according to a secondembodiment will be explained. FIG. 8 is a perspective view of asemiconductor chip carrying adhesive sheet according to the secondembodiment of the present invention, FIG. 9 is a perspective view of acover member according to the same embodiment, and FIG. 10 is aschematic perspective view of when adhering the semiconductor chipcarrier and the cover member according to the same embodiment.

As shown in FIG. 8, the semiconductor chip carrying adhesive sheet 6 inthe present embodiment comprises a base material 61, and a plurality ofadhesive agent portions 62 formed in an orderly line on the basematerial 61 for adhering semiconductor chips. In the present embodiment,the adhesive agent portions 62 are formed in 6 rows×6 columns on thebase material 61, but it is not limited to this arrangement.

A material to be used for the semiconductor chip carrying adhesive sheet6 is basically the same as that in the above semiconductor chip carryingadhesive tape 1. A thickness of the base material 61 is preferably about5 to 300 μm, particularly preferably 20 to 100 μm.

Note that in the present embodiment, an adhesive agent portion foradhering a cover member is not formed on the base material 61 of thesemiconductor chip carrying adhesive sheet 6, but an adhesive agentportion for adhering a cover member may be formed at a predeterminedposition as far as it does not contact an adhesive agent portion 62 foradhering the above semiconductor chip.

A semiconductor chip carrier can be obtained by sticking a semiconductorchip 2 to the adhesive agent portion 62 of the above semiconductor chipcarrying adhesive sheet 6 in a similar way to in the above semiconductorchip carrying adhesive tape 1. The semiconductor chip 2 can be directlymounted on a lead frame from the semiconductor chip carrier, and also,as shown in FIG. 10, a cover member 7 maybe adhered to the semiconductorchip carrier 8 for storage and transportation of the semiconductor chipcarrier 8 (a semiconductor chip 2 attached with an adhesive agentportion 62).

As the cover member 7, for example, one as shown in FIG. 9 can be used.The cover member 7 is tray shaped, has a width and length correspondingto a size of the above semiconductor chip carrier 8, and has a pluralityof rectangular concave portions (6 rows×6 columns) formed in an orderlyline to constitute chip housings 71 thereon.

Adhesive agent portions 72 for adhering the semiconductor chip carrier 8are formed on a peripheral portion, a center line portion in thelengthwise direction and a center line portion in the crosswisedirection of the cover member 7 in the present embodiment, but thepositions on which the adhesive agent portions 72 are formed are notparticularly limited as far as the adhesive agent portion 72 does notget into the chip housings 71. Also, the adhesive agent portion 72 isnot necessarily formed on the cover member 7 side if an adhesive agentportion for adhering the cover member 7 is formed on the base material61 of the semiconductor chip carrier 8.

The embodiments explained above are described for easier understandingof the present invention and not to limit the present invention.Accordingly, elements disclosed in the above embodiments include alldesign modifications and equivalents belonging to the scope of thepresent invention.

According to the semiconductor chip carrying adhesive tape, sheet or asemiconductor chip carrier of the present invention, the yield of anadhesive agent attached semiconductor chip can be improved and awasteful use of the adhesive agent can be prevented. Namely, the presentinvention is useful for mounting a semiconductor chip on a lead frame ata low cost.

EXAMPLES

Below, the present invention will be explained further in detail byexamples, but the scope of the present invention is not limited to theexamples.

Example 1

Production of Semiconductor Chip Carrying Adhesive Tape (Adhesive Agent:Composition A)

A copolymer having an weight average molecular weight of 900,000 wasprepared by copolymerizing 55 parts by weight of butyl acrylate, 10parts by weight of methyl methacrylate, 20 parts by weight of glycidylmethacrylate and 15 parts by weight of 2-hydroxyethyl acrylate.

A composition A was obtained by mixing 10 parts by weight of the abovecopolymer, 24 parts by weight of liquid bisphenol A type epoxy resin(Epikote 828 produced by Yuka Shell Epoxy Co., Ltd), 10 parts by weightof o-cresol novolac type epoxy resin (EOCN-104S produced by NIPPONKAYAKU Co., Ltd.), 0.05 part by weight ofγ-glycidoxypropyltrimethoxysilane as a coupling agent, 1.5 part byweight of dicyandiamide as a thermal activation latent curing agent, 1.5part by weight of 2-phenyl-4,5-hydroxymethylimidazole, 5 parts by weightof urethane acrylate type oligomer (Seikabeam 14-29B produced byDainichiseika Color & Chemicals Mfg. Co., Ltd.) as a photopolymerizablelow molecular compound, 0.2 part by weight of 1-hydroxycyclohexyl phenylketone as a photopolymerization initiator and 1 part by weight ofaromatic polyisocyanate (Colonate L produced by Nippon PolyurethaneIndustry Co., Ltd.) as a crosslinking agent.

A polyethylene terephthalate (PET) tape (thickness: 38 μm, width: 20 mm,surface tension: 34 dyne/cm) one surface of which was releasing treatedby a silicone resin was used as a base material, and the abovecomposition A was coated by screen process printing to be a thickness of20 μm and a size of 10 mm×10 mm at intervals of 10 mm on the releasingtreated surface of the base material. Then, the coated composition A wasdried at 100° C. for 1 minute to form an adhesive agent portion foradhering a semiconductor chip so that a semiconductor chip carryingadhesive tape (not corresponding to a cover member) was obtained.

On the other hand, 92 parts by weight of butyl acrylate, 4.5 parts byweight of acrylic acid, 0.5 parts by weight of 2-hydroxyethyl acrylate,3 parts by weight of styrene, 200 parts by weight of ethyl acetate, 0.5parts by weight of azobisisobutyronitrile were mixed, stirred for 30minutes in nitrogen atmosphere and then reacted at 60° C. for 8 hours.As a crosslinking agent, 0.2 parts by weight ofhexamethylenediisocyanate was added to 100 parts by weight (solidcontent) of the obtained copolymer and sufficiently stirred to obtain apressure sensitive adhesive agent for adhering a cover member.

After that, the above pressure sensitive adhesive agent was coated to bea width of 1 mm by micro-die at both end portions of the above basematerial on a part of the above semiconductor chip carrying adhesivetape so that a semiconductor chip carrying adhesive tape (correspondingto a cover member) was obtained.

Example 2

Production of Semiconductor Chip Carrying Adhesive Tape (Adhesive Agent:Polyimide Type Resin)

A semiconductor chip carrying adhesive tape was made in a similar way toin the example 1 except that a tetrahydrofuran solution (solid content:20 wt %) of thermoplastic polyimide (Upitite UPA-N221 produced by UbeIndustries Ltd.) was used instead of the composition A in the example 1,a polyethylene naphthalate (PEN) film (surface tension: 34 dyne/cm) onesurface of which was releasing treated was used instead of the PET filmone surface of which was releasing treated in the example 1, and thecondition of drying the thermoplastic polyimide was 90° C. for 5minutes.

Example 3

Production of Semiconductor Chip Carrying Adhesive Tape (Adhesive Agent:Epoxy Type Resin Composition)

An epoxy type resin adhesive agent was prepared by mixing 40 parts byweight of high molecular bisphenol type epoxy resin (Epikote 1010produced by Yuka Shell Epoxy Co., Ltd), 20 parts by weight of amultifunctional cresol novolac type epoxy resin (EOCN-4600 produced byNippon Kayaku Co.,Ltd.), 1.5 parts by weight of2-phenyl-4,5-hydroxymethylimidazole as a thermal activation latentcuring agent, and 0.1 part by weight of γ-glycidepropyltrimethoxysilane.

A semiconductor chip carrying adhesive tape was made in a similar way toin the example 1 except for using the above epoxy type resin adhesiveagent instead of the composition A in the example 1.

Example 4

Production of Semiconductor Chip Carrying Adhesive Sheet (AdhesiveAgent: Composition A)

A PET sheet (thickness: 38 μm, 210 mm×210 mm, surface tension: 34dyne/cm) one surface of which was releasing treated by a silicone resinwas used as a base material, and the above composition A was coated byscreen process printing to be a thickness of 20 μm and a size of 10mm×10mm at intervals of 10 mm (10 rows×10 columns). Then, the coatedcomposition A was dried at 100° C. for 1 minute to form an adhesiveagent portion for adhering a semiconductor chip so that a semiconductorchip carrying adhesive sheet was obtained.

Example 5

Production of Semiconductor Chip Carrying Adhesive Sheet (AdhesiveAgent: Polyimide Type Resin)

A semiconductor chip carrying adhesive sheet was made in a similar wayto in the example 4 except that a tetrahydrofuran solution (solidcontent: 20 wt %) of thermoplastic polyimide (Upitite UPA-N221 producedby Ube Industries Ltd.) was used instead of the composition A in theexample 4, a polyethylene naphthalate (PEN) sheet (surface tension: 34dyne/cm) one surface of which was releasing treated was used instead ofthe PET sheet one surface of which was releasing treated in the example4,and the condition of drying the thermoplastic polyimide was 90° C. for5 minutes.

Example 6

Production of Semiconductor Chip Carrying Adhesive Sheet (AdhesiveAgent: Epoxy Type Resin Composition)

A semiconductor chip carrying adhesive sheet was made in a similar wayto in the example 4 except for using the epoxy type resin adhesive agentin the example 3 instead of the composition A in the example 4.

Example 7

Production of Semiconductor Chip Carrier (Tape: Example 1)

Non-defective semiconductor chips were stuck to the adhesive agentportions for adhering the semiconductor chips on the semiconductor chipcarrying adhesive tape obtained in the example 1 by a method shown inFIG. 3 to obtain a semiconductor chip carrier.

Example 8

Production of Semiconductor Chip Carrier (Tape: Example 2)

Non-defective semiconductor chips were hot-pressed (180° C., 5 kg/cm²,30 seconds) to be adhered to the adhesive agent portions for adheringthe semiconductor chips on the semiconductor chip carrying adhesive tapeobtained in the example 2 by a method shown in FIG. 3 to obtain asemiconductor chip carrier.

Example 9

Production of Semiconductor Chip Carrier (Tape: Example 3)

Non-defective semiconductor chips were hot-pressed (140° C., 5 kg/cm²,30 seconds) to be adhered to the adhesive agent portions for adheringthe semiconductor chips on the semiconductor chip carrying adhesive tapeobtained in the example 3 by a method shown in FIG. 3 to obtain asemiconductor chip carrier.

Example 10

Production of Semiconductor Chip Carrier (Sheet: Example 4)

Non-defective semiconductor chips were stuck to the adhesive agentportions for adhering the semiconductor chips on the semiconductor chipcarrying adhesive sheet obtained in the example 4 by conventional meansto obtain a semiconductor chip carrier.

Example 11

Production of Semiconductor Chip Carrier (Sheet: Example 5)

Non-defective semiconductor chips were hot-pressed (180° C., 5 kg/cm²,30 seconds) to be adhered to the adhesive agent portions for adheringthe semiconductor chips on the semiconductor chip carrying adhesivesheet obtained in the example 5 by conventional means to obtain asemiconductor chip carrier.

Example 12

Production of Semiconductor Chip Carrier (Sheet: Example 6)

Non-defective semiconductor chips were hot-pressed (140° C., 5 kg/cm²,30 seconds) to be adhered to the adhesive agent portions for adheringthe semiconductor chips on the semiconductor chip carrying adhesivesheet obtained in the example 6 by conventional means to obtain asemiconductor chip carrier.

Example 13

Mounting of Semiconductor Chip (Carrier: Example 7, 10)

After irradiating ultraviolet rays (ADWILL RAD-2000 m/8 produced byLintec Corporation was used. irradiation conditions: luminance of 340mW/cm², irradiation time of 6 seconds) to the adhesive agent portions ofthe semiconductor chip carrier (not corresponding to a cover member)obtained in the example 7 and of the semiconductor chip carrier obtainedin the example 10, an adhesive agent portion attached semiconductor chipwas picked up and put on an island portion of a lead frame. Aftertemporarily adhering the semiconductor chip and the lead frame at 150°C. and 5 kg/cm² for 5 seconds, they were furthermore heated at 160° C.for 60 minutes to firmly adhere the semiconductor chip and the leadframe via the above adhesive agent portion.

Example 14

Mounting of Semiconductor Chip (Carrier: Example 8, 11)

An adhesive agent portion attached semiconductor chip was picked up fromthe semiconductor chip carrier obtained in the example 8 (notcorresponding to a cover member) and from the semiconductor chip carrierobtained in the example 11 and put on an island portion of a lead frame.After temporarily adhering the semiconductor chip and the lead frame at180° C. and 5 kg/cm² for 10 seconds, they were furthermore heated at180° C. for 60 minutes to firmly adhere the semiconductor chip and thelead frame via the above adhesive agent portion.

Example 15

Mounting of Semiconductor Chip (Carrier: Example 9, 12)

An adhesive agent portion attached semiconductor chip was picked up fromthe semiconductor chip carrier obtained in the example 9 (notcorresponding to a cover member) and from the semiconductor chip carrierobtained in the example 12 and put on an island portion of a lead frame.After temporarily adhering the semiconductor chip and the lead frame at180° C. and 5 kg/cm² for 5 seconds, they were furthermore heated at 180°C. for 60 minutes to firmly adhere the semiconductor chip and the leadframe via the above adhesive agent portion.

Example 16

Production of Semiconductor Chip Packaging Body (Tape)

A cover member was made of polystyrene (thickness: 500 μm, width: 16 mm)by a vacuum forming to form chip housings having a size of 10 mm×10 mmand a depth of 3 mm at intervals of 10 mm on the cover member.

The semiconductor chip carriers (corresponding to a cover member)obtained in the examples 7 to 9 and the above cover member were woundwhile adhering them by a method shown in FIG. 6 to obtain asemiconductor chip packaging body.

Example 17

Production of Semiconductor Chip Packaging Body (Sheet)

A cover member was made of polystyrene (thickness: 500 μm, 210 mm×210mm) by a vacuum forming to form chip housings having a size of 10 mm×10mm and a depth of 3 mm at intervals in 10 mm by 10 rows×10 columns.Also, the pressure sensitive adhesive agent in the example 1 was coatedby micro-die on a peripheral portion, a center line portion in thelengthwise direction and a center line portion in the crosswisedirection of the cover member to have a width of 1 mm.

The semiconductor chip carrier obtained in the examples 10 to 12 and theabove cover member were adhered by conventional means to obtain asemiconductor chip packaging body.

What is claimed is:
 1. A semiconductor chip carrying adhesive tape,wherein a plurality of adhesive agent portions are intermittently formedon a surface of a tape shaped base material in a longitudinal directionof said base material in a substantially identical shape with that of asemiconductor chip to be adhered or a slightly larger shape than that ofthe semiconductor chip to be adhered, the surface of the tape shapedbase material on which the plurality of adhesive agents are formedhaving an associated surface tension of not more than 40dyne/centimeter, and an adhesive agent constituting said adhesive agentportions having gradable adhesiveness.
 2. The semiconductor chipcarrying adhesive tape as set forth in claim 1, wherein second adhesiveagent portions for adhering a cover member are adhered at both endportions of said tape shaped base material so as not to contact theplurality of adhesive agent portions for adhering said semiconductorchip.
 3. A semiconductor chip carrying adhesive tape according to claim2, wherein a thickness of the second adhesive agent portions is about 5to 50 μm.
 4. A semiconductor chip carrier, which can be obtainable bysticking one or more semiconductor chips each to one of the plurality ofadhesive agent portions on the surface of the tape shaped base materialon which the plurality of adhesive agents are formed as set forth inclaim
 1. 5. A semiconductor chip packaging body, which can be obtainableby adhering the semiconductor chip carrier as set forth in claim 4 and acontinuous cover member on which a plurality of chip housings areintermittently formed in the longitudinal direction so that thesemiconductor chips on said semiconductor chip carrier are housed in thechip housings on said cover member.
 6. A semiconductor chip carryingadhesive tape according to claim 1, wherein a thickness of the adhesiveagent portions is about 3 to 200 μm.
 7. A semiconductor chip carryingadhesive tape according to claim 1, further comprising a releasematerial applied to the surface of the tape shaped base material onwhich the plurality of adhesive agents are formed for creating thesurface tension of not more than 40 dyne/centimeter.
 8. A semiconductorchip carrying adhesive tape according to claim 7, wherein the releasematerial is made from one of an alkyd resin type, a silicone resin type,a fluorine resin type, an unsaturated polyester resin type, a polyolefinresin type, a long chain alkyl resin type and a wax type releasingagent.
 9. A semiconductor chip carrying adhesive sheet, wherein aplurality of adhesive agent portions are formed on a surface of a sheetshaped base material in a substantially identical shape with that of thesemiconductor chips to be adhered or a slightly larger shape than thesemiconductor chips to be adhered, the surface of the sheet shaped basematerial on which the plurality of adhesive agents are formed having anassociated surface tension of not more than 40 dyne/centimeter, and anadhesive agent constituting said adhesive agent portions having gradableadhesiveness.
 10. A semiconductor chip carrier, which can be obtainableby sticking one or more semiconductor chips each to one of the pluralityof adhesive agent portions on the surface of the sheet shaped basematerial on which the plurality of adhesive agents are formed as setforth in claim
 9. 11. A semiconductor chip packaging body, which can beobtainable by adhering the semiconductor chip carrier as set forth inclaim 10 and a tray shaped cover member on which a plurality of chiphousings are formed so that the semiconductor chips on saidsemiconductor chip carrier are housed in the chip housings on said covermember.
 12. A semiconductor chip carrying adhesive tape according toclaim 9, wherein a thickness of the adhesive agent portions is about 3to 200 μm.
 13. A semiconductor chip carrying adhesive tape according toclaim 9, further comprising a release material applied to the surface ofthe sheet shaped base material on which the plurality of adhesive agentsare formed for creating the surface tension of not more than 40dyne/centimeter.
 14. A semiconductor chip carrying adhesive tapeaccording to claim 13, wherein the release material is made from one ofan alkyd resin type, a silicone resin type, a fluorine resin type, anunsaturated polyester resin type, a polyolefin resin type, a long chainalkyl resin type and a wax type releasing agent.
 15. A semiconductorchip packaging body, comprising: a plurality of semiconductor chips; asemiconductor chip carrying adhesive tape on which the plurality ofsemiconductor chips are stuck and that is formed from a tape shaped basematerial that includes a plurality of adhesive agent portionsintermittently formed thereon in a longitudinal direction and in asubstantially identical, or slightly larger, shape than that of theplurality of semiconductor chips, wherein an adhesive agent constitutingthe adhesive agent portions has gradable adhesiveness; and a continuouscover member including a plurality of chip housings formed in thelongitudinal direction for housing the plurality of semiconductor chips.